1. Advances in electronic packaging, 1995 : proceedings of the International Intersociety Electronic Packaging Conference - INTERpack 95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Luhaina, Maui, Hawaii
پدیدآورنده : Sponsored by the Electrical and Electronic packaging Division, ASME, The Japan Society of Mechanical Engineers; edited by Tai Ran Hsu, Avram Bar-Cohen, Wataru Nakayama
کتابخانه: Central Library of Amirkabir University of Technology (Tehran)
موضوع : Electronic packaging - Congresses
رده :
TK
7870
.
15
.
I57
1995
2. Application of fracture mechanics in electronic packaging and materials : presented at the International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, Claifornia
پدیدآورنده : sponsored by the electrical and Electronic Packaging Division, ASME, The Materials Division, ASME ; edited by Tien Y. Wu ... ]et al.[
کتابخانه: Central Library of Amirkabir University of Technology (Tehran)
موضوع : Electronic packaging - Materials - Congresses , Materials - Electric properties - Congresses
رده :
TK
7870
.
15
.
A85
1995
3. CAE/CAD and thermal management issues in electronic systems
پدیدآورنده : / Sponsord by the electrical and electronic packaging division, ASME, edited by Derje Agonafer [et. al.]
کتابخانه: Library of Campus2 Colleges of Engineering of Tehran University (Tehran)
موضوع : Electronic apparatus and appliances - Temmpreture control - Congresses,Electronic packaging - Design - Data processing - Congresses,Heat-Tranmission--Data processing - Congresses,Heat sinks (Electronics) - Congresses,Computer - aided engineering - Congresses
رده :
TK
7870
.
25
.
C34
1997
4. CAE/CAD and thermal management issues in electronic systems
پدیدآورنده : / Sponsord by the electrical and electronic packaging division, ASME, edited by Derje Agonafer [et. al.]
کتابخانه: Tehran University, technical faculty libraries 1 (Tehran)
موضوع : Electronic apparatus and appliances - Temmpreture control - Congresses,Electronic packaging - Design - Data processing - Congresses,Heat-Tranmission--Data processing - Congresses,Heat sinks (Electronics) - Congresses,Computer - aided engineering - Congresses
رده :
TK
7870
.
25
.
C34
1997
5. Eleventh Annual IEEE semiconductor thermal measurement and management symposium, February 7-9, 1995, Red Lion Hotel San Jose, CA USA
پدیدآورنده : The Components, Packaging, & Manufacturing Technology )CHMT( Society, Symposium Sponsor, Institute of Electrical and Electronics Engineers
کتابخانه: Central Library of Amirkabir University of Technology (Tehran)
موضوع : Semiconductors - Thermal properties - COngresses , Semiconductors - Cooling - COngresses
رده :
TK
7871
.
85
.
I27
I33
1995
6. Proceedings 1994 IEMT Symposium : Sixteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium September 12-14, 1994, La Jolla, CA, US
پدیدآورنده : Sponsored by the Electronic Industries Association, IEEE Components, Packaging, and Manufacturing Technology Society
کتابخانه: Central Library of Amirkabir University of Technology (Tehran)
موضوع : Electronic industries - Automation - Congresses , Electronic apparatus and appliances - Design and construction - Congresses , Electronic packaging - Congresses
رده :
TK
7836
.
I33
1994
7. Sensing, modeling and simulation in emerging electronic packaging: presented at the 1996 ASME International Mechanical Engineering Congress and Exposition , November 17-22, 1996, Atlanta, Georgia
پدیدآورنده : sponsored by the Elctrical and Electronic Packaging Division, ASME ; edited by Chao-Pin Yeh, Charled Ume
کتابخانه: Central Library of Amirkabir University of Technology (Tehran)
موضوع : Electronic Packaging - Congresses , Multichip modules )Microelectronics( - Congresses
رده :
TK
7870
.
15
.
A852
1996
8. Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
پدیدآورنده : sponsored by the Manufacturing Engineering Division, ASME, The Electrical and Electronic Packaging Division, ASME ; edited by Charles Ume, Chao Pin-Yeh
کتابخانه: Central Library of Amirkabir University of Technology (Tehran)
موضوع : Electronic packaging - Congresses
رده :
TK
7870
.
15
.
A854
1995
9. Structural analysis in microelectronics and fiber optics 1994: presented at 1994 International Mechanical Engineering Congress and exposition, Chicago, Illinois, november 6-11,1994
پدیدآورنده : sponsored by the Electrical and Electronic Packaging Division ASME, edited by Ephraim Suhir
کتابخانه: Central Library and Information Center of Ferdowsi University of Mashhad (Khorasan Razavi)
موضوع : Microelectronics - Congresses,Fiber optics - Congresses,Congresses ، Structural analysis )Engineering(
رده :
TK
7874
.
A534
1994
10. Structural analysis in microelectronics and fiber optics, 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
پدیدآورنده : sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by E. Suhir
کتابخانه: Central Library of Amirkabir University of Technology (Tehran)
موضوع : Microelectronic packaging - Congresses , Fiber optics - Congresses , Structural analysis )Engineering( - Congresses
رده :
TK
7874
.
S84527
1997
11. Tenth Annual IEEE semiconductor thermal measurement and management symposium, February 1-3, 1994, Red Lion Hotel San Jose, CA USA
پدیدآورنده : The Components, Packaging, & Manufacturing Technology )CHMT( Society, Symposium Sponsor, Institute of Electrical and Electronics Engineers
کتابخانه: Central Library of Amirkabir University of Technology (Tehran)
موضوع : Semiconductors - Thermal properties - COngresses , Semiconductors - Cooling - COngresses
رده :
TK
7871
.
85
.
I27
I33
1994
12. The electronics assembly handbook
پدیدآورنده : edited by Frank Riley & the staff of electronic packaging & production
کتابخانه: Central Library and Information Center of Birjand University (South Khorasan)
موضوع : ، Electronic apparatus & appliances- Assembly
رده :
TK
7870
.
E43
E4
